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Platform Capabilities

Yield intelligence built for fab-floor engineers

Wafercadence connects your inspection tools, probe test data, and MES in real time to deliver root-cause evidence within 12 minutes of any defect event.

  • Inline Defect Classification CNN-based per-defect labeling at 97.3% accuracy across 14nm and below nodes
  • Spatial Pattern Recognition Detects edge-ring, center-spot, arc, and scratch signatures at counts as low as 3 defects per lot
  • Yield Correlation Engine Joins inline defect events to WAT probe electrical data to find which layers are actually killing yield
  • Fab-Wide Lineage Tracking Traces every defect cluster to equipment ID, chamber, recipe version, and shift
  • SPC-APC Integration Feeds spatial defect statistics back into existing SPC charting and APC setpoint loops