Yield visibility from sort to final test.
Wafercadence correlates bin map spatial patterns, parametric test distributions, and STDF-sourced test data against upstream wafer inspection records — giving OSAT yield engineers the chain from sort yield bin failure to the process layer where the problem originated.
Where OSAT yield teams lose ground.
Sort yield vs final test yield gap
Sort yield looks acceptable, but final test yield is 2–4% below target. The gap is real, the source is upstream, and the data to find it exists in the bin map — if you can correlate it.
Bin 5/6/7 failure attribution
Specific bin failures are appearing at consistent spatial positions on the wafer but no one has time to manually cross-reference the parametric test records with the probe station log.
Parametric test outlier containment
Outlier parts are escaping to final test because parametric test limits are set too wide. Signature detection on the parametric distribution would catch them at sort — but no one has built that tool yet.
Built for the assembly and test floor.
We are not a test data management system and we do not replace your ATE control software. Wafercadence reads the test data your existing prober and handler stack already produces, then finds the spatial and parametric patterns inside it that indicate upstream process root causes.
Bin Map Spatial Analysis
Detect spatial clustering in bin failure patterns. Edge-ring failures, center-spot failures, and row/column patterns indicate systematic upstream process issues.
Parametric Test Signature Detection
CNN-based signature detection on parametric test distributions. Identifies multimodal distributions and distribution tail anomalies before they reach final test yield.
Sort-to-Final-Test Correlation
Cross-correlate sort yield with final test yield by bin category, lot, and die position. Quantify which sort escapes are contributing to final test yield loss.
Assembly Parameter Correlation
Wire bond pull strength, die attach void analysis, and underfill coverage data correlated against final test failures. Find the assembly process signature in the yield data.
Lot-Level Commonality Analysis
When multiple lots show the same bin map pattern, commonality analysis identifies the shared equipment, handler, or recipe version — across test cell ID, handler ID, and socket position.
SECS/GEM Integration
GEM300 and SECS-II/HSMS integration with automated test equipment (ATE). Connects to Advantest, Teradyne, and compatible test cell architectures.
From bin map ingest to corrective action.
Bin Map Ingest
Probe station bin map files loaded via SECS/GEM or ATE export path. Parametric test data loaded in parallel. Lot traveler cross-referenced automatically.
Parametric Correlation
Sort yield bin patterns correlated against parametric test signatures and assembly process parameters. Upstream photolithography overlay shift cross-referenced when available.
Corrective Action
Ranked root cause hypothesis delivered: spatial pattern type, suspected upstream process layer, assembly parameter correlation score, and recommended containment action.
Ready to close the sort-to-final-test gap?
Our OSAT yield engineering team understands your test floor. Bring your bin map data — we'll show you what the spatial patterns are telling you.