Equipment OEE Tracking
Availability, performance, and quality metrics for every tracked process tool — correlated against yield data in the same view. Know which equipment is contributing to yield loss before it becomes a post-mortem finding.
Equipment OEE that connects to yield, not just uptime.
Standard OEE tracking gives you equipment uptime, throughput, and first-pass yield for the equipment's own process step. The Wafercadence Equipment OEE module adds the missing dimension: how much is this equipment's performance contributing to downstream yield loss?
The module pulls availability data from the SECS/GEM equipment state machine, performance data from throughput and cycle-time logs, and quality data from the in-line inspection results for wafers processed by each tool. The quality dimension is correlated with D0 defect density measurements, not just equipment-side pass/fail flags.
Yield-linked OEE scores surface which tools have high uptime but poor yield quality — the category most likely to be misidentified as a process-recipe issue rather than an equipment contamination or uniformity problem.
| Parameter | Description | Value |
|---|---|---|
| OEE components | Availability × performance × quality | SEMI E10 standard definitions |
| Equipment state source | Real-time state tracking | SECS/GEM E5/E10 state machine |
| Quality metric | Yield-linked quality dimension | D0 defect density per tool per lot |
| Process coverage | Validated tool categories | CMP, etch, deposition, litho, inspection |
| Update frequency | OEE score recalculation | Per-lot completion |
| Fleet view | Comparative ranking | All tracked tools, sortable by OEE dimension |
OEE tracking across the process tool fleet.
CMP Tools
Slurry flow rate, head downforce pressure, polish pad wear, and post-CMP D0 defect density. CMP uniformity CDU tracked per chamber head. Alert on slurry flow deviation correlated with edge ring yield events.
Etch Tools
Etch uniformity across wafer die positions, gas flow ratio stability, chamber pressure, and end-point detection timing. Etch CDU correlated with wafer map scatter pattern emergence.
Deposition Tools
Thin film deposition uniformity, precursor flow, and wafer temperature profile. Deposition thickness non-uniformity correlated with in-line inspection D0 increase following high-D0 deposition batches.
Photolithography Tools
Overlay error, CDU (critical dimension uniformity), and focus-exposure matrix. Litho overlay shift correlated with systematic defect pattern emergence across matched exposure fields.
Inspection Tools
Inspection tool availability, recipe-match, and sensitivity calibration. Tracks inspection tool nuisance rate (false defect fraction) per recipe. Nuisance-corrected D0 used for yield correlation.
Fleet Comparison View
Comparative ranking of all tracked tools by OEE dimension (availability, performance, quality). Sortable by yield-quality score to surface the equipment most likely contributing to current yield loss.
Find the equipment that's costing you yield points.
Bring your equipment list and we'll show you how Wafercadence maps SECS/GEM state data to yield-linked OEE scores in your first evaluation session.